SEMICONDUCTOR SEALING MOLD AND SEALING METHOD,申请号JP19960031427-传众专利搜索

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发明名称	SEMICONDUCTOR SEALING MOLD AND SEALING METHOD
摘要
申请公布号	JPH09205107(A)	申请公布日期	1997.08.05
申请号	JP19960031427	申请日期	1996.01.25
申请人	SONY CORP	发明人	NISHIYAMA HIROYUKI
分类号	H01L23/28;H01L21/56;(IPC1-7):H01L21/56	主分类号	H01L23/28
代理机构		代理人
主权项
地址

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