| 摘要 |
A semiconductor device test head docking interface system includes a test head plate juxtaposed to a test head. The tester plate includes pairs of outwardly facing spaced vacuum cups and pairs of spaced guiding and locking pins between the cups. A handler plate includes pairs of vacuum cup receiving surfaces spaced to receive the vacuum cups upon a docking of the plates, and pairs of receiving sockets spaced to receive the guiding and locking pins upon a docking of the plates. Rotary actuators are mounted on the tester plate for rotating each of the guiding and locking pins in a respective one of the receiving sockets, such that engagement and a pulling vacuum in the vacuum cups against the vacuum cup receiving surfaces and rotation of the guiding and locking pins, effects docking of the tester plate and handler plate. A Z-axis adjustment is provided in each actuator.
|
