| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer printed circuit board of a structure, wherein the bonding strength of an external layer conductor pattern with the surface, which is a flat surface, to an outermost insulating layer is good and the external layer conductor pattern and other conductor patterns can be formed in a high density. SOLUTION: When a multilayer printed circuit board is manufactured into a structure, wherein conductor patterns are respectively laminated on both surfaces of a base material 12 in a multilayer via insulating layers and the laminated conductor patterns are electrically connected with each other through vias, an internal layer conductor pattern 20, which is positioned on the side of the internal layer of said base material, is formed by a method, wherein after a metal layer is formed on an insulating layer 18 formed by coating an insulative resin by a plating or the like, a patterning, such as an etching, is performed on this metal layer. Then, a metal foil 32 with a resin, which is formed by providing an insulative resin layer 23, is compression-bonded on one surface of a metal foil 25, such as a copper foil, via the layer 23 in such a way that the surface of the foil 25 becomes a flat surface to laminate the metal foil 25 on the pattern 20 and thereafter, a patterning, such as an etching, is performed on the foil 23 and an outermost conductor pattern, which is positioned on the side of the outermost layer of the base material 12, is formed. |
