| 摘要 |
PROBLEM TO BE SOLVED: To attain the reduction of a space required for inter-plate connection, realization of high density of an inter-plate connecting terminal and improving of reliability relating to connection. SOLUTION: In this device, a second circuit board (electronic circuit module) 3 is mounted in a first circuit board (mother board) 1. Here, the device has an insulator 13 and a plurality of connection terminals 12 securing an intermediate part to the insulator 13, a receiving contact surface 13, with which a lower surface of the second circuit board 3 comes into contact, and a stand off 13d coming into contact with an upper surface of the first circuit board 1 are provided in the insulator 13, a connector has a first connection part 12b into contact with an upper surface of the second circuit board 3 with a lower surface into contact with the receiving contact surface 13 and a second connection part 12c into contact with an upper surface of the first circuit board 1, in the connection terminal 13, this connector 11 is used, the electronic circuit module is mounted in the mother board. |
