| 摘要 |
PROBLEM TO BE SOLVED: To dispense with a control of a compression bonding force when a metal foil is compression-bonded to a board. SOLUTION: When a multilayer interconnection board of a structure, wherein a second conductor pattern 18 is formed on a first conductor pattern 12 formed on one surface of a board 10 via an insulating layer, is manufactured, a metal foil 26 is heated and compression-bonded to one surface of the board 10 formed with the pattern 12 and is laminated on the board 10 via a first insulating layer 14, which consists of a semicured thermosetting insulative resin, and a second insulating layer 16, which consists of a thermosetting insulative resin having a fluidity and is thinner than the layer 14. Then, an etching work or the like is performed on the foil 26 to form a second conductor pattern 18 and thereafter, via holes for electrically connecting the patterns 12 and 18 with each other are formed penetratingly the layers 14 and 16 cured by the heating in the case of the lamination of the foil 26. |
