PROCESS FOR CHANGING THE BEND OF ANODICALLY BONDED FLAT COMPOSITE BODIES MADE OF GLASS AND METAL OR SEMICONDUCTOR MATERIALS

摘要

PCT No. PCT/EP95/03825 Sec. 371 Date Oct. 6, 1997 Sec. 102(e) Date Oct. 6, 1997 PCT Filed Sep. 27, 1995 PCT Pub. No. WO96/11806 PCT Pub. Date Apr. 25, 1996A method for the controlled bending of anodically bonded two-dimensional composites of glass and metal or semiconductor materials. The composite is heated after bonding, for up to 200 hours to a temperature of from 250 DEG C. to Tg-10 K. As a result of this heating, controlled compaction of the glass body and, hence, bending of the composite, are achieved to reduce or reverse any distortion that has occurred during bonding.