| 发明名称 |
Wafer dicing/bonding sheet and process for producing semiconductor device |
| 摘要 |
<p>A wafer dicing/bonding sheet comprising a soft film, a pressure sensitive adhesive layer formed on the soft film, a processing film for polyimide type resin composed of a heat resistant resin which has been formed on the pressure sensitive adhesive layer and a polyimide adhesive layer formed on the processing film. It is preferred that the processing film be a polyethylene naphthalate film whose surface has been subjected to an alkyd release treatment. The present invention facilitates expansion to be conducted after the wafer dicing.</p> |
| 申请公布号 |
EP0786802(A2) |
申请公布日期 |
1997.07.30 |
| 申请号 |
EP19970300361 |
申请日期 |
1997.01.21 |
| 申请人 |
TEXAS INSTRUMENTS JAPAN LTD.;LINTEC CORPORATION |
发明人 |
UMEHARA, NORITO;AMAGAI, MASAZUMI;KOBAYASHI, MAMORU;EBE, KAZUYOSHI |
| 分类号 |
H01L21/301;H01L21/304;H01L21/68;H01L23/495;(IPC1-7):H01L21/304;H01L23/498 |
主分类号 |
H01L21/301 |
| 代理机构 |
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