| 摘要 |
PROBLEM TO BE SOLVED: To obtain an epoxy resin composition, excellent in moisture and solder heat resistances, hardly being influenced by moisture absorption and useful for a sealed semiconductor device by using a specific epoxy resin and a specified phenol resin. SOLUTION: This epoxy resin composition consists essentially of (A) an epoxy resin having a diphenylmethane skeleton of formula I, (B) a cyclopentadiene-phenol polymer of formula II [R is a group of the formula Cm H2m+1 ; (m) and (n) are each 0 or an integer of >=1], (C) an inorganic filler (preferably a silica powder having <=30μm average grain diameter) and (D) a curing accelerator, with the proviso that the component (C) is contained in an amount of 25-93wt.% based on the whole resin composition. Moreover, the sealed semiconductor device comprises a semiconductor chip sealed with a cured product of the epoxy resin composition.
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