发明名称 |
Method of making a multilayer electronic component with inter-layer conductor connection utilizing a conductive via forming ink |
摘要 |
A multilayered electronic component created by a wet process, wherein a ceramic base is imprinted with an electrode and an interlayer via is formed on top of it by introducing a via pattern printed in ink that is incompatible with a layer of wet ceramic slurry coating placed on top of the electrode and the via pattern. The incompatibility leads to a physical-chemical reaction that removes ceramic material away from the top of the via pattern by diffusing ceramic materials contained in a colloidal suspension forming a via-through hole. After the wet ceramic slurry is dried, it surrounds the via-through hole and the imprinted via pattern. Then a new electrode layer is imprinted on top of the dried ceramic coating. The new electrode layer completes an electrically conductive path formed from the bottom-most electrode layer, to the via pattern, and then terminating at the new electrode layer on top. |
申请公布号 |
US5650199(A) |
申请公布日期 |
1997.07.22 |
申请号 |
US19950562158 |
申请日期 |
1995.11.22 |
申请人 |
AEM, INC. |
发明人 |
CHANG, DANIEL H.;MCADAMS, ARTHUR C.;LI, XIANGMING |
分类号 |
C04B41/52;C04B41/89;H01L21/48;H01L23/498;H01L23/538;H05K1/03;H05K1/09;H05K3/40;H05K3/46;(IPC1-7):B05D3/04;B05D5/12 |
主分类号 |
C04B41/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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