PROCESSO DI FABBRICAZIONE DI MODULI CIRCUITALI IBRIDI INCLUDENTI DISPOSITIVI ELETTRONICI IN CHIP

摘要

There is described a process for manufacturing hybrid circuit modules including electronic chip devices. The process comprises the steps of: (a) realization of a plurality of identical passive circuits on microstrip by means of deposit of metallic films on the front of a dielectric substrate, and of an extended metallization on the back having ground plane function, said plane being electrically connected by means of metallized through holes to grounding points of the front circuit; (b) connection of one or more chip devices to each of said passive circuits; (c) sealing of said metallized holes; (d) superimposition of respective capsules on the hybrid circuits achieved in (b) and sealed connection thereof to the substrate, the dimensions of the capsule being such that outside them emerge some microstrips for connection of the hybrids; (e) cutting of the substrate to separate the individual hybrid modules.