| 摘要 |
<p>PURPOSE:To prevent the occurrence of bending, etc., of leads caused by handling and transfer before a semiconductor PKG for surface mounting is mounted on its base plate. CONSTITUTION:An elastic protect part 3 is molded and secured from the shoulder part of the lead of a semiconductor PKG1 to the entire periphery of lower side face of a mold within the range of from the lower part of the mold to the lower face and a frame 2 positioned around the outer periphery of the semiconductor PKG lead 10 and thicker than the semiconductor PKG1 is connected to the protect part by a bar 4. The frame and the semiconductor PKG are set in a molding die and resins are poured into the protect part forming grooves and bar forming grooves provided in the lead shoulder part of the molding die and are solidified thereby producing a semiconductor PKG carrier.</p> |
