发明名称 SEMICONDUCTOR WAFER ALIGNMENT MEMBER AND CLAMP RING
摘要 <p>PROBLEM TO BE SOLVED: To provide a method and a device for preventing contact between a clamp ring and a member with respect to a semiconductor substrate alignment member so as to avoid generation of a shadow on the substrate, aligning a shield member across the substrate supported on a supporting member, and fixing the substrate onto the supporting member. SOLUTION: In alignment of a semiconductor substrate 26 on a supporting member 14, a frustoconical substrate alignment member 16 is extended around a substrate receiving surface of the supporting member 14 so as to capture the substrate 26 received in a chamber and to place the substrate 26 at the center on the upper surface of the supporting member 14. On the supporting member 14, a clamp ring alignment member 47 is provided for aligning and supporting a clamp ring 12 on the substrate. The clamp ring 12 is aligned vertically and horizontally with the supporting member 14 and the substrate 26, the center of which is located on the clamp ring.</p>
申请公布号 JPH09186226(A) 申请公布日期 1997.07.15
申请号 JP19960319332 申请日期 1996.11.29
申请人 APPLIED MATERIALS INC 发明人 DAN MAROORU;MAIKERU ROOZENSUTAIN
分类号 B24B37/04;H01L21/68;H01L21/683;H01L21/687;(IPC1-7):H01L21/68 主分类号 B24B37/04
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