发明名称 WAFER SUPPORT MEMBER
摘要 <p>PROBLEM TO BE SOLVED: To modify the surface of an elastomer provided to a wafer support member so as to decrease particles attached to the rear of a wafer and to prevent the wafer from adhering to the elastomer by a method wherein a prescribed dose of ion is infected into the elastomer provided onto the wafer support member. SOLUTION: A wafer support pad 10 is composed of support members 16 provided to the tips of arms 14 disposed to a hub 12 extending in a radial manner, wherein the hub 12 is located at the center of the support pad 10, and an elastomer 16a of silicone rubber or the like is pasted on each upside of the support members 16. The hub 12 is made to pivot or swing, whereby a beam of fluorine ion (F<+> ) is made to scan all the surface of the elastomer 16a, so that all the surface of the elastomer 16a is irradiated with a beam of fluorine ion (F<+> ). Therefore, ions are implanted into the surfaces of the wafer support members 16, and the surfaces of the wafer support members 16 can be modified, so that particles attached to the rear of a wafer are reduced in amount, and the wafer can be prevented from adhering to the surface of the wafer support member 16.</p>
申请公布号 JPH09186224(A) 申请公布日期 1997.07.15
申请号 JP19950352776 申请日期 1995.12.28
申请人 APPLIED MATERIALS INC 发明人 MIURA RYUICHI;ISHIGAKI HIDEKI;MATSUNAGA YASUHIKO
分类号 C23C14/50;H01L21/265;H01L21/68;H01L21/683;(IPC1-7):H01L21/68 主分类号 C23C14/50
代理机构 代理人
主权项
地址