| 摘要 |
PROBLEM TO BE SOLVED: To provide an etching end point measuring method using pH values. SOLUTION: In this etching end point measuring method, etchant is supplied into a container, an object to be etched is placed within the container and wet etching of the object is conducted. During wet etching, the change of the pH value is measured. Using the pH value, the in the thickness of the object is calculated. When the calculated thickness change reaches a preset thickness change, it is determined that an etching end point is detected. |
