| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer polishing device capable of stably providing wafers having excellent flatness. SOLUTION: This wafer polishing device has a surface plate 3 over which abrasive cloth 2 is stretched, a polishing head 4 provided above a position off the center of the surface plate 3, and a plate 7 installed below the polishing head 7; on the plate 7, a carrier 6 provided with a backing pad 12 for pressing a wafer W and designed to be capable of carrying the plurality of wafers W is provided in such a way as to be freely rotatable with respect to the plate 7, so that the wafer W is polished as it is rotated around the plate 7 while revolving on its own axis. |
