| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component wherein strength to deflection at the time of circuit board mounting is improved. SOLUTION: This component 10 has a laminate 11 formed by laminating a plurality of insulating sheets in the state that a circuit element is interposed in the inside. A recessed part 13 is formed in the almost central part of a mounting surface 12 of the laminate 11, and a first surface 12a and a second surface 12b which is recessed as compared with the first surface 12a are formed. That is, the first surface 12a of the mounting surface 12 is formed in almost a square- shape along the outer periphery of the mounting surface 12. External electrodes 14 are formed on the first surface 12a and side surfaces 11a, 11b. |
