发明名称 Substrate transfer apparatus, and method of transferring substrates
摘要 In a vertical heat treatment apparatus, a transfer apparatus is used to transfer a wafer between a wafer carrier and a wafer boat. The transfer apparatus comprises a base unit, a fork, three non-contact type sensors, and a main controller. The base unit can move between a first position at which to transfer the wafer to and from the wafer carrier and a second position at which to transfer the wafer to and from the wafer boat. The fork can move back and forth with respect to the base unit, for supporting the wafer. The non-contact type sensors are mounted on the fork, for detecting the position of the wafer. The main controller controls the base unit and the fork in accordance with the data detected by the non-contact type sensors.
申请公布号 US5645391(A) 申请公布日期 1997.07.08
申请号 US19950455662 申请日期 1995.05.31
申请人 TOKYO ELECTRON LIMITED;TOKYO ELECTRON TOHOKU LIMITED 发明人 OHSAWA, TETU;TATEYAMA, KIYOHISA
分类号 B65G49/07;H01L21/00;H01L21/677;(IPC1-7):B65G49/07 主分类号 B65G49/07
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