| 摘要 |
<p>PROBLEM TO BE SOLVED: To obtain a method for injection molding of a base material for an IC card and a mold therefor which enable molding of the base material for the IC card of high quality without necessitating a complicated machining process. SOLUTION: In an injection mold 1 for manufacturing a base material for an IC card wherein a stepped recession made up of a middle step part 2a and a lower step part 2b is formed in a plate-shaped main body part so as to bury an IC module therein, a gate bush 8 extending to the lower step part 2b is provided on the recession side of the middle step part 2a and a gap 10 for an air vent is formed between the gate bush 8 and a mold die 3.</p> |
