PHOTOSENSITIVE RESIN COMPOSITION

摘要

A photosensitive resin composition useful to prepare dry film photoresist for circuit design of PCB, comprising photo-polymerizable monomer which comprises at least one species of water-soluble monomer and at least one species of water-insoluble monomer, both carrying two or more unsaturated reactive groups, the water-soluble monomer amounting to 3-15 % by weight based on the solid content of the composition, and the reactive groups in total range from 0.5 to 1.5 mole per kg of the solid content. From the composition, one may prepare photoresist showing rapid developing speed in addition to being superior in flexibility and plating chemical resistance.