Board center registration for solder paste deposition

摘要

To produce registration of a printed circuit board with a stencil for solder paste deposition, movable pins first engage the stencil, are locked into place, the stencil removed, the printed circuit board engaged to the pins, and the stencil returned to the engagement with the pins. Mounting the pins modularly allows different size printed circuit boards and stencils to register with each other.