发明名称 Method for bonding steel to copper
摘要 A method is used to bond dissimilar metals, such as for an x-ray tube. Copper and steel tubular components are provided. An interlayer material situated between the metal layers is used to bond the copper and steel tubular components by solid state diffusion process. The interlayer material may be pure nickel, pure copper, or a layered combination of nickel and copper or copper alloy. The use of the low cost interlayer material and the solid state diffusion process yields a strong bond between the dissimilar metals.
申请公布号 US5642853(A) 申请公布日期 1997.07.01
申请号 US19950521001 申请日期 1995.08.30
申请人 GENERAL ELECTRIC COMPANY 发明人 LEE, DAVID SEUNG-KYU
分类号 B23K20/00;B23K35/00;B23K35/30;(IPC1-7):B23K20/227 主分类号 B23K20/00
代理机构 代理人
主权项
地址