发明名称 |
Method of manufacturing a hybrid integrated circuit component having a laminated body |
摘要 |
A hybrid (composite) integrated circuit element comprises a substrate, a thin film type integrated circuit formed on a substrate through a thin film process, and a lamination type passive circuit element such as a capacitor, inductor, resitance and a combination thereof formed on the integrated circuit. During the firing of passive circuit element in a hydrogen atmosphere, the semiconductor layer which constitutes the integrated circuit is also heat annealed. Various substrates can be used as the substrate, for example, quartz, ceramic and a cheap semiconductor substrate which has not been treated with a mirror-grinding by the use of a glass layer.
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申请公布号 |
US5643804(A) |
申请公布日期 |
1997.07.01 |
申请号 |
US19940242813 |
申请日期 |
1994.05.16 |
申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
ARAI, MICHIO;YAMAUCHI, YUKIO;SAKAMOTO, NAOYA;NAGANO, KATSUTO |
分类号 |
H01L27/10;H01L21/336;H01L25/16;(IPC1-7):H01L21/265;H01L21/70;H01L27/00 |
主分类号 |
H01L27/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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