| 摘要 |
PROBLEM TO BE SOLVED: To realize wiring of high density using a simple process by previously forming a conductor part which penetrates in the thickness direction and connects corresponding wiring pattern layers, in a specified part of an insulating sheet constituting an interlayer insulating layer. SOLUTION: On an angular bump 2 forming surface of a retaining substratum 1, an insulating sheet 3 and a caul 4 are positioned and laminated in order. On both main surfaces of an insulating sheet 6 having conductor (interlayer connection parts) 5, electrolytic copper foils 7, 7 are laminated and arranged. A both-sides copper clad plate 8 wherein the electrolytic copper foils 7 and 7 are electrically connected by the conductor (interlayer connection parts) 5 is formed. On both surfaces of a both-sided printed wiring board 9, insulating sheets 6 having the conductor 5 are positioned and laminated, and further copper foils 7, 7 are laminated and arranged. After the laminate is unified in a body, a printed wiring board 10 wherein wiring pattern layers are electrically connected by the conductor 5, 5 previously buried in the insulating sheets 6, 6 is formed. |
