发明名称 |
LEAD FRAME THAT HAS EXCELLENT ADHESION PROPERTY |
摘要 |
PROBLEM TO BE SOLVED: To provide a metal lead frame of reinforced adhesiveness with a polymer resin. SOLUTION: A metal layer 20 on the outermost side contains a mixture of chromium and zinc having a zinc-to-chromium ratio of about 4:1 or greater and having chromium of zinc characteristic deposited thereto. The metal layer 20 on the outermost side is adhered to a polymer resin. An inner conductor 16 of a conductive metal substrate 14 is sealed in a molded plastic package 10. The conductive metal substrate 14 is made of a copper-based alloy. |
申请公布号 |
JPH09172125(A) |
申请公布日期 |
1997.06.30 |
申请号 |
JP19960205863 |
申请日期 |
1996.08.05 |
申请人 |
OLIN CORP |
发明人 |
PAASASARASHI AABINDO;MAFURIKAA DEIIPATSUKU |
分类号 |
C23C30/00;C22C9/00;C22C9/06;H01L21/56;H01L23/28;H01L23/48;H01L23/495;H01L23/50 |
主分类号 |
C23C30/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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