发明名称 LEAD FRAME THAT HAS EXCELLENT ADHESION PROPERTY
摘要 PROBLEM TO BE SOLVED: To provide a metal lead frame of reinforced adhesiveness with a polymer resin. SOLUTION: A metal layer 20 on the outermost side contains a mixture of chromium and zinc having a zinc-to-chromium ratio of about 4:1 or greater and having chromium of zinc characteristic deposited thereto. The metal layer 20 on the outermost side is adhered to a polymer resin. An inner conductor 16 of a conductive metal substrate 14 is sealed in a molded plastic package 10. The conductive metal substrate 14 is made of a copper-based alloy.
申请公布号 JPH09172125(A) 申请公布日期 1997.06.30
申请号 JP19960205863 申请日期 1996.08.05
申请人 OLIN CORP 发明人 PAASASARASHI AABINDO;MAFURIKAA DEIIPATSUKU
分类号 C23C30/00;C22C9/00;C22C9/06;H01L21/56;H01L23/28;H01L23/48;H01L23/495;H01L23/50 主分类号 C23C30/00
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