CURVED SURFACE FORMING AND POLISHING DEVICE AND METHOD

摘要

PROBLEM TO BE SOLVED: To provide a curved surface forming and polishing device capable of polishing an object to be polished such as a wafer at high precision and at high speed, and making it flat. SOLUTION: A polishing plate 2 is rotated by a spindle motor 3 at high speed such as at 1500rpm. A wafer 9 held to a wafer sucking film 12 is rotated at 50rpm. The front surface of the wafer 9 is polished by an abrasive pad 1 while making a slider 6 traverse along a rail 26 at the specified amplitude and speed.