| 摘要 |
PROBLEM TO BE SOLVED: To set an active layer near to a heat sink so as to obtain a vertical resonant-type planar emission laser(VCSEL) which is enhanced in thermal properties, lessened in heat resistance, and high in efficiency by a method wherein an absorption board is replaced with a transparent board taking advantage of a bonding of a wafer. SOLUTION: An upper distributed Bragg reflector 53 and a lower distributed Bragg reflector 55 are arranged adjacent to an active layer 51 possessed of an upper and a lower surface. A transparent board 57 is bonded to the upper distributed Bragg reflector 53, and contact points 59 and 61 are provided to apply a voltage to an active region. As mentioned above, taking advantage of bonding of a compound semiconductor wafer, the transparent board 57 is substituted for an absorption board, whereby the active layer 51 of a VCSEL 50 is set near to a heat sink 63, and the VCSEL 50 can be mounted on the heat sink 63 making a junction face downward, so that a mounted device can be markedly improved in heat resistance. |
