| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an IC packaging assembly of high density which may be realized easily at low costs, by fixing at least a pair of male and female fixed members on adjacent upper and lower surfaces of stacked IC packages. SOLUTION: A plurality of IC packages 50a and 50b having leads 52a and 52b protruding in direction substantially vertical with respect to upper and lower surfaces are stacked and assembled. The lower surface of one IC package 50a is a arranged on the upper surface of the other IC package 50b. In addition, male and female fixed members 54 and 56 are fixed on the adjacent lower and upper surfaces of the stacked IC packages 50a and 50b, respectively. The male and female fixed members 54 and 56 constitute a snap fastener, thereby preventing the leads 52a and 52b of the IC packages 50a and 50b from contacting each other.</p> |
