SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To easily connect bump electrodes on a semiconductor wafer before the wafer is diced into semiconductor chips by reducing the height of bump electrodes stepwise from the center to the periphery of the semiconductor wafer. SOLUTION: A semiconductor wafer 1 containing semiconductor chips 2 has bump electrodes 3 formed thereon in such a manner that the height of the bump electrodes 3 is reduced stepwise from the center to the periphery of the wafer. Specifically, the height of the bump electrodes 3 is adjusted so that the following equation will hold: 0.8R(R-x)/2r<=<=1.3R(R-x)/2r. This adjustment for optimization enables simple batch probing. In addition, the height of adjoining bump electrodes 3 is varied. Specifically, the bump electrodes 3 the diameters L1 23, Ln-1 , Ln and L2 24 of which are the same and the heights h1 , hn-1 , hn and h2 of which are different from one another are formed in the height ratio of 0.8