| 摘要 |
<p>A thermal shunt apparatus directs heat flux transmitted through electrical signal leads from a focal plane array (FPA) (110) to a relatively isothermal top surface of a TE cooler (130). The FPA mounts with a first thermally conductive attachment to a thermal spreader plate (120) that is highly thermally conductive. The thermal spreader plate is mounted to the top surface of the TE cooler by a second thermally conductive attachment (122). The combination of the relatively isothermal surfaces, the FPA thermal spreader and the TE cooler top plate, separated by the thermally conductive interface, maintains a relatively constant temperature difference between the electrical leads (180) connected between the thermal shunt (140) and the FPA edge. The constant temperature difference provides for constant heat flux between these points and a constant temperature gradient across the surface of the FPA.</p> |
