发明名称 High voltage semiconductor rectifier
摘要 925,853. Semi-conductor devices. PACIFIC SEMICONDUCTORS Inc. Nov. 9, 1959 [Dec. 8, 1958], No. 37913/59. Class 37. A rectifier for voltages in excess of 1500 volts comprises a plurality of electrically interconnected individually hermetically sealed semiconductor rectifier diodes in a common hermetically sealed housing. In one assembly, Fig. 2, a number of sealed PN junction silicon diodes 22 are mounted on the axis of a silica filled epoxy resin tube 10. The individual diodes, which comprise tubular glass casings 23 through which metal terminal pins 25, 26 are hermetically sealed, are joined in series by nickel-clad copper wires 27 to form a subassembly. The latter is placed vertically in tube 1 (Fig. 4) with one of its terminal wires 37 threaded through an epoxy resin plug 31 and epoxy resin poured in through funnel 34. Before the resin is hardened by heat a second plug 35 is inserted in the open end of the tube. Laminated epoxy resin impregnated woven fibreglass sleeves 13, 14, coated with epoxy resin are inserted in caps 11, 12 and after heating are coated internally with the resin and pushed over the ends of the tube. The assembly is again heated to harden the resin and the protruding ends of terminal wires 28 cut short, bent into the recesses 17, 16, in the end caps and soldered in place with a tin-antimony solder. In an otherwise similar assembly, Fig. 5, the end caps are of a different construction. In the Fig. 6 arrangement the individual diodes, interconnected as described above, are press-fitted in apertures in a plastic magazine 56. The magazine is assembled in a polytrifluorochloroethylene, epoxy resin or fibreglass tube 70. Apertured metal end caps with resin applied to the threads are screwed on the reduced ends of the tube far enough to make a pressure seal against shoulders 51 and the assembly heated to cure the resin. One of the protruding terminal wires is cut off and soldered in place as in Fig. 2 and the tube filled in vacuo with epoxy resin through the other end cap. After heating to cure the resin the second terminal wire is cut off and soldered in place.
申请公布号 US2979645(A) 申请公布日期 1961.04.11
申请号 US19580779271 申请日期 1958.12.08
申请人 PACIFIC SEMICONDUCTORS, INC. 发明人 MAIDEN CLINTON E.
分类号 H01L25/03;H02M7/10 主分类号 H01L25/03
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