发明名称 DEVICE FOR THE APPLICATION OF JOINT MATERIAL DEPOSIT
摘要 PCT No. PCT/DE96/02078 Sec. 371 Date Jun. 15, 1998 Sec. 102(e) Date Jun. 15, 1998 PCT Filed Oct. 30, 1996 PCT Pub. No. WO97/17191 PCT Pub. Date May 15, 1997Device for the singled-out application of joining material deposits (30), particularly solder beads, from a joining material reservoir (11) with an application device (13) and a singling-out device (12) for singling-out joining material deposits from the joining material reservoir, wherein the singling-out device (12) is designed as a conveying device (20) for the singled-out transfer of joining material deposits (30) to the application device (13).
申请公布号 WO9717191(A3) 申请公布日期 1997.06.26
申请号 WO1996DE02078 申请日期 1996.10.30
申请人 FINN, DAVID;RIETZLER, MANFRED 发明人 FINN, DAVID;RIETZLER, MANFRED
分类号 B23K1/005;B23K3/06 主分类号 B23K1/005
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