WAFER BONDER AND WAFER BONDING METHOD USING IT

摘要

PROBLEM TO BE SOLVED: To avoid scratching the surface of a wafer by providing a second base disposed at an upper part of a first base the lower face of which has a specified slant to the top face of the first base and a nozzle on the front of a wafer mounting unit. SOLUTION: A wafer debonder has a first base 100a flat at the top and second base 100b located at an upper part of the first base 100a the lower face of which has a specified slant to the top face of the base 100a. It also has a wafer mount 200 composed of a coupler to couple both bases 100a and 100b, first holder 110 mounted on the base 100a, second holder 120 disposed at an extension of the bottom face of the base 100b and nozzle 130 disposed on the front of the wafer mount 200 to jet a ion-removed water on the boundary of the bonded wafer.