发明名称 |
Thermostable coating materials |
摘要 |
Novel intermediate compounds capable of being applied to a semiconductor precursor by spin-on methods which exhibit good planarity and gap-fill characteristics, the cured composites of which are capable of withstanding temperatures in excess of 500 DEG C. The disclosure further encompasses a process for fabricating semiconductor devices utilizing the intermediate compounds and its composite.
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申请公布号 |
US5641838(A) |
申请公布日期 |
1997.06.24 |
申请号 |
US19950486906 |
申请日期 |
1995.06.07 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
LINDE, HAROLD GEORGE;PREVITI-KELLY, ROSEMARY ANN;REEN, THOMAS JOSEPH |
分类号 |
C08L83/06;C08G73/10;C08G77/54;C08L83/02;C09D183/14;H01L21/302;H01L21/3065;H01L21/312;(IPC1-7):C08G77/26 |
主分类号 |
C08L83/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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