| 摘要 |
PROBLEM TO BE SOLVED: To raise the connection reliability by diminishing the dispersion of connecting balls of a ball grid array and the influence of the warping of a mother board, and preventing lateral mispositioning. SOLUTION: A ball grid array and a mother board 1 are electrically connected through the medium of conductive connecting balls 5 fixed to the base board of the ball grid array. On the mother board 1, ring-shaped copper pads 6 are formed at positions corresponding to the connecting balls 5, and the connecting balls 5 are positioned so that the lower ends of the connecting balls may be inside the ring-shaped copper pads.
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