EXCIPIENT HAVING HIGH COMPACTABILITY AND PROCESS FOR PREPARING THE SAME

摘要

A fabrication method of tantalum condenser is provided to remove a thermal stress due to a soldering. The method comprises the steps of: adhesively contacting a silver case(5) having a spaced part(4) and a negative leadframe(2) using a silver paste(3); filling the silver paste(3) into the spaced part(4); and inserting a tantalum element(1) into the spaced part(4). Thereby, it is possible to prevent the thermal stress due to the soldering when contact between the tantalum element(1) and the negative leadframe(2).