Vakuumgreifer zum Tragen eines Halbleiterwafers

摘要

Disclosed is a vacuum tweezer used in carrying a semiconductor wafer in the process of fabricating a semiconductor, the vacuum tweezer comprises a shaped vacuum tip 10 having a flat body 11c connected to a pumping line 20 through a vacuum pump and two flat extensions 11a and 11b projected from the body so as to vacuum-suction the wafer, and at least three suction portions 12, 14, and 16 formed on the flat front surface. Because at least three suction portions are formed on the flat front surface of the vacuum tweezer, the suction force on a wafer can be improved. Furthermore, because the vacuum tip is a shaped structure, even though the state of vacuum is broken due to the flexibility of the vacuum tip, a semiconductor wafer can be vacuum-suctioned sufficiently. Each suction area comprises an oval groove with a suction hole e.g. 12a and two rectangular supports e.g. 12b, 12c.