Interconnection apparatus for semiconductor/integrated circuit devices

摘要

An interconnection assembly for electrically connecting the contacts of an integrated circuit device with the contacts of said circuit board. The interconnection assembly having a base removably and adjustably attached to the circuit board and further having a preselected configuration for accepting the integrated circuit device therein such that the contacts thereon are aligned with the contacts on the circuit board. A bladder-like member having fluid therein is interposed between the integrated circuit and a closure element for forcing the bladder-like member into contact with the integrated circuit device thereby causing the contacts thereon to make electrical connections with the contacts on the circuit board. The base can accept various sized integrated circuit devices therein and the base having an edge thereon for supporting the periphery of the bladder-like member in such a position to enable the majority of the undersurface of the bladder-like member to bear against the integrated circuit device during electrical connection with the circuit board.