Vorrichtung zur Prüfung der Klebehaftung eines Trägerelements mit IC-Bausteinen in einer Chipkarte

摘要

Method of checking the adhesive bond (4) between a carrier strip (1) for an IC chip (1C) and the surface of an electronic card (2) employs a press (not shown) to stress the bond (4) to failure. The strip (1C) is encapsulated by a casting resin (1H) on the carrier strip (1) having external connections (1G) brought out to contacts (1E) on one side of the plate (1) and the reverse side of the plate (1) is bonded to the shoulders (34) of a cavity (3) in the card (2) by the adhesive (4). The back surface (2B) of the card (2) is machined away to allow a press tool (6) to exert increasing force on the chip assembly supported by the platen (5) until bond fracture occurs.