| 摘要 |
There is disclosed an enhancement composition and a method for its use in a molding process. The enhancement composition is applied to the interior surfaces of the mold cavity used in a molding process such as blow molding, injection molding, thermoforming or rotational molding. The enhancement composition is applied prior to closing of the mold and molding of the plastic article. The enhancement composition comprises a liquid carrier containing up to about 50 weight percent of enhancement solids which comprise a mixture of an enhancement solid such as particles of varied thermoplastic and thermosetting resins, metal flakes, glass beads, carbon, graphite, etc., and a binder solid which can be hydrocarbon resin, wax, rosin or terpene base resin. The invention provides for almost unlimited modification of the surfaces of molded plastic products, offering the plastics fabricator the ability to mold products having very specialized surface properties with a low cost structural polymer, e.g., a product molded of low cost, low density polyethylene having the surface characteristics of Teflon3.
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