| 摘要 |
A micromechanical component includes a fixed micromechanical structure having at least two electrodes being formed of one or more conductive layers, and a movable micromechanical structure in a void or chamber forming a conductive switch element, for making an electrical contact between the electrodes with the aid of the switch element. The void or chamber can have a, for example, grid-shaped device for securing the switch element against falling out and/or a seal at the top. A microsystem with an integrated circuit and the micromechanical component, as well as a production process for the component and the microsystem, are also provided. The component and the circuit can therefore be produced simultaneously in a very simple manner.
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