| 摘要 |
PROBLEM TO BE SOLVED: To improve the seal performance and moisture resistance by avoiding forming voids or insufficient charging of a resin fed by pressure from a gate formed at one side face into the cavity of a semiconductor device resin encapsulating die. SOLUTION: A gate 17 is disposed at the side face of one of cavities 13 and 14 to feed a resin by pressure into them and air vents 18 and 19 are disposed at this side face and opposite side face thereto to vent air from the cavities. When a resin 27 is injected into the cavities 13 and 14, air is also vented from the vent 18 at the gate side and hence blocked from being involved into the resin at this part where forming of voids or insufficient charging are avoided. |
