发明名称 HOUSING OF ELECTRICAL DEVICE AND MANUFACTURE OF THIS HOUSING
摘要 <p>PROBLEM TO BE SOLVED: To obtain a housing of an electrical device not requiring any soldering work and moreover allowing injection molding of the body by using general-pur pose resin. SOLUTION: A housing has a base 3 composed of injection molding of a synthetic resin material and wiring patterns 35a, 35b connecting a land 36 to a terminal part 40. Further, a flexible printed wiring board 30 housed by the body and lead wires 44a, 44b are provided. Here, the printed wiring board 30 is is integrally molded with the body in an injection molding of this body.</p>
申请公布号 JPH09148753(A) 申请公布日期 1997.06.06
申请号 JP19950301464 申请日期 1995.11.20
申请人 TOSHIBA CORP 发明人 OMAE CHIKAO
分类号 H05K5/00;H01R24/00;H01R43/18;H05K1/00;H05K7/14;(IPC1-7):H05K5/00;H01R23/02 主分类号 H05K5/00
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