ETCHING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE,申请号JP19950302598-传众专利搜索

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发明名称	ETCHING METHOD AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH09148270(A)	申请公布日期	1997.06.06
申请号	JP19950302598	申请日期	1995.11.21
申请人	SONY CORP	发明人	FUKUDA SEIICHI
分类号	C23F4/00;H01L21/28;H01L21/302;H01L21/3065;H01L21/768;(IPC1-7):H01L21/28;H01L21/306	主分类号	C23F4/00
代理机构		代理人
主权项
地址

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