| 摘要 |
PROBLEM TO BE SOLVED: To provide a phase inversion mask which has a flat surface and uniform thickness. SOLUTION: Light shielding patterns 32 for limiting light shielding regions and light transparent regions are formed on a substrate 30. A phase inversion film 34 is thickly formed on the substrate 30 formed with the light shielding patterns 32 and the surface of the phase inversion film 34 is flattened. The phase inversion regions are restricted by patterning the phase inversion film 34, by which the phase inversion mask including the phase inversion patterns 34a have the flat surface and the uniform thickness is formed. |
