| 摘要 |
PROBLEM TO BE SOLVED: To decrease the size of a semiconductor chip as a sensor chip thereby making more compact an image sensor to be mounted by forming at least part of a scanning circuit in a gap between photoelectric transfer elements. SOLUTION: A semiconductor chip 10 has an outer appearance of a rectangle approximately; square shaped photoelectric transfer elements 12 each having one side 62.5μm long is arranged along one of the long side of this rectangle; and bonding pads 14, each having a square shape 70μm long for each side for taking out the output of the semiconductor chip 10 to the outside, are arranged along another long side of the rectangle. And a circuit region 16 is provided in a space where a scanning circuit is mounted between the photoelectric transfer element 12 and the bonding pads 14. Since this circuit region 16 has an extending region 16a extended between photoelectric transfer elements 12, the compactness can be realized and obtained by reducing the size of short sides of the semiconductor chip 10 while securing the area of the circuit region 16.
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