发明名称 |
Halbleiterbauelement mit Schottkykontakt |
摘要 |
The invention relates to a semiconductor device having a Schottky contact on a silicon layer (1), which contact has a metal silicide layer (2) formed in a contact window (13) of a surface passivation (5). The surface passivation comprises a first passivation layer (15) and a second passivation layer (16) which defines the contact window (3). The boundary between the metal silicide layer (2), a guard ring (6) and the surface passivation is moved towards the middle of the guard ring by the second passivation layer (16). Consequently, increased short-circuit resistance, a reduced risk of an early breakdown or of a formation of a channel are achieved.
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申请公布号 |
DE19544326(A1) |
申请公布日期 |
1997.06.05 |
申请号 |
DE19951044326 |
申请日期 |
1995.11.28 |
申请人 |
SIEMENS AG, 80333 MUENCHEN, DE |
发明人 |
WERTHMANN, HUBERT, DIPL.-PHYS., 81247 MUENCHEN, DE |
分类号 |
H01L21/329;H01L21/78;H01L29/47;H01L29/872;(IPC1-7):H01L29/872;H01L29/41 |
主分类号 |
H01L21/329 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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