发明名称 Halbleiterbauelement mit Schottkykontakt
摘要 The invention relates to a semiconductor device having a Schottky contact on a silicon layer (1), which contact has a metal silicide layer (2) formed in a contact window (13) of a surface passivation (5). The surface passivation comprises a first passivation layer (15) and a second passivation layer (16) which defines the contact window (3). The boundary between the metal silicide layer (2), a guard ring (6) and the surface passivation is moved towards the middle of the guard ring by the second passivation layer (16). Consequently, increased short-circuit resistance, a reduced risk of an early breakdown or of a formation of a channel are achieved.
申请公布号 DE19544326(A1) 申请公布日期 1997.06.05
申请号 DE19951044326 申请日期 1995.11.28
申请人 SIEMENS AG, 80333 MUENCHEN, DE 发明人 WERTHMANN, HUBERT, DIPL.-PHYS., 81247 MUENCHEN, DE
分类号 H01L21/329;H01L21/78;H01L29/47;H01L29/872;(IPC1-7):H01L29/872;H01L29/41 主分类号 H01L21/329
代理机构 代理人
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