发明名称 Bonded pin extrusion die and method
摘要 <p>A honeycomb extrusion die and a method of making the die are disclosed, the die being made by bonding a die discharge section (24) formed as a separate pin array to a separate die body (20) incorporating an array of feed channels, the pin array comprising a plurality of pins (24a) attached to and extending outwardly from a body-compatible pin support (24c) which is removed after bonding the pins (24a) to the body. The pins (24a) may be formed of hard wear materials, and may have any of a variety of cross-sectional shapes adapted to improve extrusion uniformity as well as to form honeycomb cells of a variety of different cross-sectional shapes. <IMAGE></p>
申请公布号 EP0776744(A1) 申请公布日期 1997.06.04
申请号 EP19960118257 申请日期 1996.11.14
申请人 CORNING INCORPORATED 发明人 KRAGLE, HARRY ARTHUR;STUMPFF, FLOYD ERNEST
分类号 B29C47/12;B28B3/20;B28B3/26;(IPC1-7):B28B3/26 主分类号 B29C47/12
代理机构 代理人
主权项
地址