发明名称 |
Fabrication and structures of circuit modules with flexible interconnect layers |
摘要 |
A method for fabricating a circuit module includes applying an outer insulative layer over a first patterned metallization layer on a first surface of a base insulative layer. A second surface of the base insulative layer has a second patterned metallization layer. At least one circuit chip having chip pads is attached to the second surface of the base insulative layer. Respective vias are formed to expose selected portions of the first patterned metallization layer, the second patterned metallization layer, and the chip pads. A patterned outer metallization layer is applied over the outer insulative layer to extend through selected ones of the vias to interconnect selected ones of the chip pads and selected portions of the first and second metallization layers. <IMAGE> |
申请公布号 |
EP0707340(A3) |
申请公布日期 |
1997.06.04 |
申请号 |
EP19950306805 |
申请日期 |
1995.09.27 |
申请人 |
MARTIN MARIETTA CORPORATION |
发明人 |
COLE, HERBERT STANLEY;FILLION, RAYMOND ALBERT;GOROWITZ, BERNARD, (NMN);KOLC, RONALD FRANK;WOJNAROWSKI, ROBERT JOHN |
分类号 |
H01L21/60;H01L21/48;H01L23/538;H05K3/32 |
主分类号 |
H01L21/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|