Method for aligning and assembling spaced components

摘要

A method for aligning and bonding spaced components, such as a baseplate and a faceplate of a field emission display, is provided. The method includes: providing an optical alignment tool suitable for flip chip bonding; calibrating the tool to simulate a desired spacing in the assembled components; aligning the components using the calibrated tool; bringing the aligned components towards one another using the calibrated tool; and then bonding the components together with the desired spacing therebetween. The method of the invention can be practiced with an aligner bonder tool calibrated to eliminate a parallax error. A spacer element placed between the bondheads of the tool can be used to simulate the desired spacing during calibration. Alternately the spacing during calibration can be simulated by measuring with a caliper or other instrument.