发明名称 Efficient generation of fill shapes for chips and packages
摘要 An efficient method for modifying a chip or package design allows for the creation of small shapes without excessive expansion of design data. A computer program takes a physical design, represented in a computer data file, and generates a modified version of the design in which fill shapes have been added. Subsequently, when the modified design is processed, the resulting semiconductor chip or package will contain physical images of the added fill shapes, with the effect of making local pattern density more uniform and hence reducing process-induced variations in feature size and shape.
申请公布号 US5636133(A) 申请公布日期 1997.06.03
申请号 US19950445447 申请日期 1995.05.19
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 CHESEBRO, DONALD G.;KIM, YOUNG O.;LAVIN, MARK A.;MAYNARD, DANIEL N.
分类号 G06F17/50;(IPC1-7):G06F17/50 主分类号 G06F17/50
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